| 摘要 |
<p>This invention relates to methods of determining physical characteristics of and identifying and locating defects in substrates, such as semiconductor wafers, optical thin films, display screens and the like. The method involve use of PC scanners to image the substrate. In particular PC scanners used in transmission mode imaging allow information about the volume of the substrate to be determined. The method allows determination of characteristics such as layer thickness, curvature and optical constants through use of interferometery techniques and bifrefringence and strain through use of polarised imaging. The methods also relate to stimulating luminescence in the substrate, for example photoluminescence and electroluminescence and scanning the stimulated substrate for luminescence mapping.</p> |
