| 摘要 |
PURPOSE:To prevent the oxcidation of an electrode during the assembling thus to improve the efficiency of the process, by forming five layers on the substrate in the order of Cr, Cu then removing the upper three layers and patterning the electrode, thereafter removing the upper two layers on the conductor composed of five layers to produce three layer structure. CONSTITUTION:Cr, Cu are sequentially laminated on two surfaces of glass substrate to form a conductor film of five layers shown by 4a, 4b, a', 10, and 11. Then it is patterned from upper layer through photoetching method to produce two layers 4a, 4b and an electrode terminal composed of five layers. Thereafter an alumina layer 6 is coated on the discharging electrode 4 to produce a dielectric layer. Then a frame 7 of encapsulation material is printed at predetermined position on the glass substrate and burnt. Furthermore a surface layer of MgO is formed on the surface of alumina layer 6 and two of said substrates are faced each other to obtain a panel. Finally the upper layers 10, 11 at the end of five layer electrode is removed through etching. Consequently the oxcidation of electrode during assembling is prevented resulting in the improvement of process efficiency. |
