Electronic device including a barrier layer and a process for forming the electronic device

摘要

An electronic device can include a substrate ( 12 ) having a primary surface ( 14 ), a second surface ( 16, 22 ) opposite the primary surface ( 14 ), and an electrode ( 50 ). In one embodiment, the electrode ( 50 ) can lie adjacent to the second surface ( 22 ) and include, a barrier layer ( 54 ) lying between a conductive layer ( 56 ) and a metal-containing layer ( 52 ), wherein the metal-containing layer ( 52 ) includes a first metallic element and not a second metal element, and the barrier layer ( 54 ) includes the second metal element and not the first metallic element. In another embodiment, an adhesion layer ( 52 ) and a conductive layer ( 56 ) can each include a metallic element, and lie immediately adjacent to a barrier layer ( 54 ). In still another embodiment, a process for forming an electronic device can include removing a portion of the substrate ( 12 ) opposite a primary surface ( 14 ).