| 摘要 |
PURPOSE:To prevent wires from coming into contact with each other in bonding, by providing a height difference between adjacent metalized parts and electrode pads which are provided on a substrate when a semiconductor device having an operating region is housed in a package. CONSTITUTION:A semiconductor substrate 1 provided with an operating region is die-bonded on a package 4 by a die-bonding part 3. The electrodes provided on the substrate 1 are connected through thin wires of Al, Au or the like to metalized layers provided in the package 4. Electrodes pads include short pads 2a which are ordinary electrodes and tall pads 2b which are projecting electrodes. The electrode pads are alternately placed. The metalized layers include short metalized parts 5a and tall metalized parts 5b and are alternately placed. The short pads and the short metalized parts are connected to each other through thin wires 6a. The tall pads and the tall metalized pads are connected to each other through thin wires 6b. According to this constitution, the thin wires do not come into contact with one another, the distance between the wires can be increased and wire connection work is facilitated. |
