| 摘要 |
PURPOSE:To prevent the deformation and mutual contact of thin wires when a semiconductor unit connected to leads through the wires is washed and dried as the unit is supported by a support member, by applying room-temperature gas blowing and high-temperature gas blowing to dry the semiconductor unit after the washing. CONSTITUTION:A semiconductor unit 3 is secured on the tab 2 of a lead frame 1. The electrodes of the unit and the leads of the frame corresponding to the electrodes are connected to each other through thin wires 4. A plurality of such units are moved on a guide rail. A nozzle 5 is provided over the units 3 to blow Freon gas onto the units. Another nozzle 6 is provided downstream to the former nozzle 5 to blow pure water onto the units to wash them. Other nozzles 7, 8 are provided over or under the rail to eject air to blow off most of the pure water adhering to the frame 1, the tabs 2 and the units 3. Still other nozzles 10, 11 are provided over or under the rail downstream to the former nozzles to blow high-temperature clean air of 100-200 deg.C to thoroughly dry the frame, the tabs and the units. |
