| 摘要 |
<p>PURPOSE:To obtain a highly efficient protective film for an electronic circuit by a method wherein a resin made by the reaction of heat-resisting resin containing hetero-cyclic compound on a phenoxyl-resin is used as a coating material. CONSTITUTION:A polyimide resin singular, having molecular weight of above 5,000 and containing closed imidic cycle above 40% in a molecule, has superior heat-resisting property but has poor formability of printed film and is scarce of adhesive property. Therefor a phenoxyl resin having the molecular weight of above 1,000 and containing at least two or more hydroxyl group in a molecule is added in 0.1-40wt% of a polyimide resin of 100wt%, solved in an organic solvent, applied to the surface of a semiconductor substrate, etc., and is dried by heating. The protective film obtained by the way keeps the heat-resisting and damp-proof property of heat-resisting resin containing heterocyclic compound, and the improvement of its scarce adhesiveness, the rapid acceleration of paint film formation, making to minute the hardening and shrinkage, and a broad drop of hardening temperature, etc., becomes possible and highly efficient protective film can be obtained.</p> |
