| 摘要 |
PURPOSE:To stabilize operation, by coating an alpha-ray shielding resin layer on an active region which is provided in a semiconductor chip and which is likely to perform wrong action when alpha-rays are irradiated upon the region. CONSTITUTION:Bump electrodes 11 are attached to the surface of a semiconductor IC chip 10 near its edges. The chip 10 has an active region such as a memory cell on the surface. Cu leads 12 are connected to the bump electrodes 11 so that the leads project outward. An alpha-ray shielding layer 13 of polyimide resin, polyester resin or the like with a thickness of 25-60mum is fixed on the leads 12 opposite the bump electrodes 11 so that the memory cell region of the chip 10 exposed between the electrodes is covered with the resin layer. As a result, no pairs of electron and positive hole are produced due to the radiation of U or Th contained in a package and troubles such as the fall or inversion of the logical level of stored information do not occur even if a device is made of the tape carrier type. |
