发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the origination of crack at a glass sealed junction part of a lead wire by a method wherein grooves are prepared on the surface of outer lead wire at right angles to the axis of wire. CONSTITUTION:U-shape grooves are prepared at two places on the circumferential surface of outer lead wire 1', 2'. Owing to this preparation, when the lead wire is bent at the neighborhood of glass sealed junction part, the wire is bent at the U- shape, and the force applied to the both end parts of glass tube 5 and welded part decreases sharply, and no crack is originated.
申请公布号 JPS55143058(A) 申请公布日期 1980.11.08
申请号 JP19790051828 申请日期 1979.04.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 OONO OSAMU
分类号 H01L23/48;H01L23/49 主分类号 H01L23/48
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