| 摘要 |
The invention relates to a semiconductor device ( 1 ) comprising a semiconductor chip stack ( 2 ) and a plastic housing ( 3 ), and to methods for producing the semiconductor device ( 1 ). The semiconductor device ( 1 ) is constructed on a device carrier ( 4 ), on which a first semiconductor chip ( 5 ) is fixed by its rear side ( 6 ). At least one second semiconductor chip ( 8 ) is adhesively bonded by its rear side ( 9 ) on the top side ( 7 ) of the first semiconductor chip ( 5 ) by means of an adhesive layer ( 10 ). A second plastic composition ( 17 ) is arranged between a first plastic housing composition ( 11 ) of the plastic housing ( 3 ) and the edge sides ( 12, 13 ) of the adhesive layer and the edge sides ( 14, 15 ) of the second semiconductor chip ( 8 ) and also the top side ( 16 ) of the second semiconductor chip ( 8 ) in such a way that the first plastic housing composition ( 11 ) has no physical contact with the second semiconductor chip ( 8 ) and with the adhesive layer ( 10 ).
|
