INTERCONNECTION DEVICE FOR A PRINTED CIRCUIT BOARD, A METHOD OF MANUFACTURING THE SAME, AND AN INTERCONNECTION ASSEMBLY HAVING THE SAME

摘要

The present invention relates to a method of manufacturing an interconnect device for a printed circuit board. According to one aspect of the present invention, a method of manufacturing an interconnect device comprises forming a protective film pattern on a sacrificial substrate for forming an interconnect device including a first contact section having a bar-like shape for making contact with a second contact terminal in a space transformer, a connecting section having an O-ring-like shape of which one side is opened and connected to one end of the first contact section in an integrated manner, a support section having an engaging protrusion in a predetermined portion and connected to one end of the connecting section in an integrated manner, and a second contact section having an O-ring-like shape and connected to one end of the support section in an integrated manner; filling a conductive material into the inside of the protective pattern, and removing the protective film pattern and the sacrificial substrate to finish the interconnect device.