SEMICONDUCTOR PACKAGE HAVING AN FLOWING GUIDE GROOVE AND METHOD OF FABRICATING THE SAME

摘要

A semiconductor package having a flowing guide groove and a method for fabricating the same are provided to control easily a thickness of a sealant by using the flowing guide groove. A package substrate(110) includes a slit and a flowing guide groove(104). A semiconductor chip(106) is mounted on the package substrate. A wire is used for connecting electrically the semiconductor chip and the package substrate to each other through the slit. A sealant is formed within the slit to surround the wire and to fill up a part of the flowing guide groove. The flowing guide groove is formed to surround a part of the slit or both ends of the slit. The flowing guide groove is arranged obliquely in a slit direction.