发明名称 LEAD FRAME
摘要 PURPOSE:To reduce the undesirable short circuit of a lead frame by patterning a thin metal plate and so forming a plurality of lead end corners extended toward a tab for mounting a circuit element as to have round ends in arcuate shape. CONSTITUTION:A circuit element 4 is mounted at a tab 5, which has tab leads 6 for supporting the tab 5 and a plurality of lead wires 7 extended toward the tab 5. The end of the lead wire 7 is so formed at both corners as to have round ends in arcuate shape 11. According to such a lead frame, even if a wire loop is moved toward the resin flowing direction by resin injection pressure when sealing the lead frame with resin after connecting wires 9 therebetween, the lowered wire loop may not make contact with the end of the lead wire 7 adjacent thereto.
申请公布号 JPS55141743(A) 申请公布日期 1980.11.05
申请号 JP19790049021 申请日期 1979.04.23
申请人 HITACHI LTD 发明人 TAKAO HIROSHI
分类号 H01L23/50;H01L21/60;H01L23/495 主分类号 H01L23/50
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