DUAL MIRROR CHIP, WAFER INCLUDING THE SAME, AND MULTI-CHIP PACKAGE INCLUDING THE SAME

摘要

The dual mirror chip, the wafer including the same and the multi-chip package including the chip are provided to test two neighboring chips at the same time and to shorten the test time. The dual mirror chip(100) comprises the first type chip(10), the second type chip(20), and the metal line part(13) and the scribe line(15). The first type chip comprises the first input pad part(11) arranged in the right and the first output pad shift(12) arranged in the left. The second type chip comprises the second input pad part(21) which is arranged in the right and the second output pad shift(22) arranged in the left. The metal line part connects the input pad of the first type chip and input pad of the second type chip. The scribe line is the sawing reference line for separating the first type chip and the second type chip from the wafer.