| 摘要 |
PURPOSE:To prevent isolation of sealing resin at a semiconductor device at its mounting time by forming a hook piece on the surface of a semiconductor element pellet mounting surface side of a header. CONSTITUTION:A circuit element 13 is soldered to a heat sink 14 plated by Ni on Cu, the heat sink 14 is solder to a ceramic plate 16, and the heat is rapidly dissipated through a header 18 to the mounting plate. The header 18 is partially raised at mold side to form a hook piece 21 and the upper end is bent and extended to the heat sink 14 side with each other to form an extension. The piece 21, the heat sink 14 and the element 13 are coated with resin 22. The lead wire 24 extended from the heat sink 14 and the lead wires 24 at both sides thereof form a lead frame 27 connected via a tie bar 26 at assembling time. When an insulating plate is interposed between the element 13 and the header 18, they can be mounted directly on the mounting plate at mounting time. By the hook piece no sealing resin is isolated to secure the airtightness and heat dissipating property thereat. |
