RADIATOR FOR SEMICONDUCTOR DEVICE

摘要

An integrated circuit heat dissipator is provided which will additionally hold the integrated circuit in a printed circuit board prior to soldering. The heat dissipator is comprised of a single elastic piece of metallic material having oppositely facing sides joined by a fold at the top. A tab is located at the bottom of each of the sides which is suitable for insertion into a printed circuit board. The tabs have a width which allows them to contact only the heat-conducting pins of the integrated circuit. The heat dissipator is mounted adjacent to the integrated circuit with one of the tabs contacting the heat-conducting pins. The elastic material gives the heat dissipator a spring-like property which causes the tabs to press outwardly from each other when inserted in a board so as to fixedly hold the heat dissipator and the integrated circuit in the printed circuit board prior to soldering.