发明名称 SEMICONDUCTOR ASSEMBLY DEVICE
摘要 <p>PURPOSE:To convey lead frames of various types by preventing the lead frames from being displaced in position thereamong owing to thermal expansion but merely changing a design only of a jig by providing positioning means which detects the position of conveyance of a conveying jig including thereon a frame fixing jig for fixing and holding the lead frame, and which thereby issues an interruption instruction at the end position of the conveyance. CONSTITUTION:A jig 14 for fixedly mounting any lead frame, which is part of a conveying jig 2, includes a stopper 15 for fixing the tip end of the lead frame, a spring 17 for resiliently supporting the stopper 15 when the stopper 15 is pushed down by a cylinder 16 from the upper upon housing the lead frame in a magazine, a lead frame guide 18 for fixing the side of the lead frame, and a fiber hole 19 for allowing a positioning fiber sensor mounted on the upper part of a conveyance rail part to detect the final end of the conveyance of the conveying jig 2. The jig 14 comprises copper for good thermal conduction to the lead frame.</p>
申请公布号 JPH01152632(A) 申请公布日期 1989.06.15
申请号 JP19870311768 申请日期 1987.12.09
申请人 NEC CORP 发明人 OGISHI KIMIHIRO
分类号 H01L21/52;H01L21/50;H01L21/677;H01L21/68 主分类号 H01L21/52
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