发明名称 |
Optical surface thickness measuring technique - uses separation of point source and secondary image to determine thickness of semiconductor at primary image point |
摘要 |
<p>The surface (E) to be studied is situated at right angles to the optical axis of an objective lens (1). A point light source (S0) situated on the axis forms an illuminated area which is a function of the distance (h) between a reference plane passing through a point (S1) and the surface (E). The surface is at least partially reflecting and returns through the objective a fraction of the radiation forming an image (S3) of the point (S2) on the test surface. The distance between the source and final image (S0-S3) is a function of the magnification of the objective (1) and the thickness (h) of the relief of the surface, measured relative to the reference plane (SO-S3=2RG squared).</p> |
申请公布号 |
FR2453392(A1) |
申请公布日期 |
1980.10.31 |
申请号 |
FR19790008373 |
申请日期 |
1979.04.03 |
申请人 |
THOMSON CSF |
发明人 |
GERALD ROULLET ET ALAIN BODERE |
分类号 |
G01B11/06;(IPC1-7):01B21/08;01B21/30;01L21/66;03F1/02 |
主分类号 |
G01B11/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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