| 摘要 |
A semiconductor device is provided to prevent damage to an electronic part from a shock applied from outside by arranging a sealing resin on a top surface of an insulation layer. Inner connection pads(78,79) are arranged on a top surface of a plurality of laminated insulation layers. Semiconductor device mounting pads(25,26) are arranged on a top surface of the laminated insulation layers. Test pads(34,35) are arranged on a bottom surface of the laminated insulation layers. Outer connection pads(31,32) are arranged on a bottom surface of the laminated insulation layers. First wiring patterns(37,38) are arranged on the laminated insulation layers. The first wiring pattern connects the inner connection pad to the test pad. A first wiring substrate(11) includes second wiring patterns(41,42) which connect the semiconductor device mounting pad to the outer connection pad. A second wiring substrate(17) is connected to the first wiring substrate through an inner connection terminal(19). |
