| 摘要 |
PURPOSE:To eliminate the improper contact of the heading portion of a slag lead wire of a DHD-type semiconductor device and the displacement of an electrode thereof by coating a thermally melting agent on the heading surface of a metallic terminal. CONSTITUTION:Ag solder 3 is coated on the heading surface 2 of a metallic terminal of a semiconductor pellet 1, the pellet 1, a raised electrode 5 and a metallic terminal 2 are thermally molten respectively when melting the glass sleeve 4 at a sealing temperature of 650 deg.-750 deg.C to provide a DHD-type configuration. It is preferred to select the Ag solder 3 so as to have lower melting point than the glass sealing temperature. |
