摘要 |
PURPOSE:To remove the burrs of molded resin automatically and quickly by a method wherein after resin is hardened and completing the lifting stroke of a plunger, the plunger thereof is lowered quickly to run through the sleeve completely, and, further, lifting the plunger thereof quickly. CONSTITUTION:In transfer molding, an electronic circuit element such as IC, after clamping the bottom part 1 and the top part 3, a plunger 5 is lowered to allow the resin tablet 2 to pass through the sleeve 4 to fill into the cavity 10 for hardening. After the resin is hardened, lifting the plunger 5, and opening the die, the plunger thereof 5 is lowered quickly in order to allow said plunger 5 to run repeatedly through the sleeve 4 completely for removing the burrs completely sticked to said plunger 5 and the sleeve 4, said plunger 5 is lifted quickly. The plunger 5 and the bottom part 1 are controlled by the cylinders 6, 7 connected with a hydraulic circuit 8 controlled by an electronic circuit 9. |