发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To provide a compact and reliable wire bonding apparatus by employing a linear actuator to reciprocate a wire clamper along the wire feeding direction. CONSTITUTION:A tool 2 is moved to the first bonding point in the state that the gripping pawls 4a, 4b of a wire clamper 4 are closed to bond a wire 3. The pawls 4a, 4b are opened, and the tool 2 is move on the second bonding point. In the meantime, the wire clamper 4 is retarded in the predetermined distances along the wire 3. Then, the wire 3 is bonded, the pawls 4a, 4b are closed to clamp the wire 3 and the wire clamper 4 is retarded in predetermined distance to cut the wire 3.
申请公布号 JPS55138853(A) 申请公布日期 1980.10.30
申请号 JP19790046878 申请日期 1979.04.17
申请人 SHINKAWA SEISAKUSHO KK 发明人 HASEGAWA TAKESHI
分类号 B23K20/00;H01L21/60 主分类号 B23K20/00
代理机构 代理人
主权项
地址