| 摘要 |
PURPOSE:To eliminate the disconnection of finger portions of a semiconductor device and to improve the yield of the semiconductor device in fabrication by accommodating an IC in an IC retaining piece for partially retaining the lower and side surfaces of the IC formed in a mold and injection molding thermoplastic resin in the mold. CONSTITUTION:A printed board 1 is connected to an IC chip 2 by finger portions 12a. The chip is accommodated in an IC retaining piece 32 for partially retaining the lower and side surfaces of the chip 2 formed in an injection mold 3. Thereafter, thermoplastic resin 31 is injection molded in the mold. |
