APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide stable inner lead wires at a semiconductor device by providing a jig moving toward the direction of an opening within a hole of lead wire cutting dies and connecting the lead wire to connection terminal. CONSTITUTION:When the male and female dies 1 and 2 of an inner lead wire cutting die are so moved as to reduce the gap 6, inner lead wires 12 are separated from a lead frame blank 9 by cutting blades 4. Then, heating and pressurizing jig 5 is moved in the direction of an opening in the dies 2 and 3 to solderlessly pressurize thermally the inner lead wires 12 thus separated to a lower lead wire 8.