| 摘要 |
<p>PURPOSE:To enhance the heat dissipating effect of a hybrid integrated circuit device by partially superimposing and connecting a ceramic substrate and a heat dissipating block, mounting a block not superimposed directly on a heat dissipating case, reducing the ceramic substrate and the conductor thereof. CONSTITUTION:A heat dissipating block 1 carrying a power semiconductor element 2 and a ceramic substrate 4 carrying a controller are partially superimposed and soldered. A stepped portion 8 formed at one side and perforated with a threaded hole 9 is formed in a heat dissipating case 7. The block 1 is mounted directly in contact with the portion 8, and the substrate 4 is located to float in the case 7. Since the fixing area between the block and the substrate can be reduced with such configuration, the size and area of the ceramic substrate may be reduced. Inasmuch as the block is mounted directly on the case, thermal resistance therebetween can be extremely reduced.</p> |
