| 摘要 |
PURPOSE:To obtain a thin resin seal by a method wherein, when a semiconductor element is sealed with resin, the element is mounted on a printed-wiring substrate, wiring connections are made, the element is surrounded by a printed frame having a wet repellent property with respect to resin, resin is dripped inside this, and by holding it with a thin insulation piece, it is solidified. CONSTITUTION:A semiconductor chip 12 is fixed on a printed-wiring substrate 11, on which specified wiring is provided. This electrode is connected to the wiring on the substrate 11 by using fine wire 13 of Au, Al or the like. Next, a printed frame 17, having a wet repellent property with respect to silicone resin is formed on the substrate 11 surrounding the chip 12, and a specified amount of resin 16 is dripped inside the frame 17. Subsequently, thin insulation piece 18, of shape matched with that of the frame 17 and having wet repellent property with respect to resin 16, such as polyimide film, is fitted on it. This is left at a fixed temperature. After the resin 16 spreads in the frame 17, it is cured. By this, the sealing resin layer is made thin, suitable for use in the hybrid circuit of the watch. |
