| 摘要 |
PURPOSE:To make high speed partial electroplating available by a method wherein regions which are to be electroplated are solely introduced into an electroplating chamber and electroplated, mask being applied, and electroplating solution being injected from lower position, circulated, degassed on the way during return, and partly electroplated at high speed. CONSTITUTION:A movable cover 42 is normally opened by spring action and masking members 41 and cover 42 are opened. When an electronic part 1 is transferred, descended between mask members and a region 1a to be electroplated is inserted into the chamber 32, the part 1 is held with the masking member between covers 41, and with the cover 42 being slided. Electroplating solution is fed from a tank and injected at the plural number of nozzles 34 to perform high speed electroplating. An electrode 33 is connected with a positive pole and the part 1 is connected with a negative pole. Electroplating solution circulates to return to the tank 55 through pathes 39, 38, and separated bubbles being swiftly ejected from holes 44, electroplating quality is improved. After electroplating is completed, solution flows to return to the tank and power is put off. The electronic part is removed from the chamber, and masking member is cleaned with a jet of water or air from a nozzle mounted on a pipe 51. By these electroplating chambers provided in parallel and working simultaneously, large quantity of partially electroplated product can be manufactured with good efficiency. |
