| 发明名称 |
Method of and apparatus for applying solder to metallic blanks |
| 摘要 |
A method of and apparatus for applying beads of solder to a metallic plate as an integral part thereof for subsequent attachment to another component in an assembly operation.
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| 申请公布号 |
US4230257(A) |
申请公布日期 |
1980.10.28 |
| 申请号 |
US19780965603 |
申请日期 |
1978.12.01 |
| 申请人 |
LIBBEY-OWENS-FORD COMPANY |
发明人 |
GENSON, CHARLES W. |
| 分类号 |
B23K3/06;(IPC1-7):B23K1/02 |
主分类号 |
B23K3/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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