发明名称 THICK FILM PHOTO INTEGRATED CIRCUIT
摘要 PURPOSE:To achieve the reduction of transmission loss and the easier connection to multimode optical fibers by forming a clad layer on at least one side of a dielectric thin plate whose both sides are optically polished to form an optical transmission path and forming a filter and the like on the wall surface of its circumference. CONSTITUTION:A thick film optical transmission path 2 and optical fibers 3, 4 are placed and connected on a substrate 1 and an ultrasonic transducer 6 is affixed on the wall surface 5 of the optical transmission path 2. The thickness of the core layer 7 and clad layer 8 of the thick film optical transmission path 2 is matched to the diameter of the core 9 and clad 10 of the optical fiber 3. The fibers are connected, with their centers being aligned by the substrate 1. In operation, the light 12 incident from the optical fiber 3 propagates in the thick film optical transmission path 2, is converted to parallel rays by a concave reflecting mirror 13 and is radiated to the ultrasonic transducer 6. When the high-frequency signal inputs to generate the elastic wave, the light 12 receives diffraction and no longer couples to the optical fiber 4.
申请公布号 JPS55137506(A) 申请公布日期 1980.10.27
申请号 JP19790045925 申请日期 1979.04.14
申请人 HASUMI RITSUO 发明人 HASUMI RITSUO
分类号 G02B6/00;G02B6/34 主分类号 G02B6/00
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