| 摘要 |
PURPOSE:To easily permit mass production and good operations by fixing electrode layers by the element molded transition metal oxide as main constituent and metal lead wires by conductive adhesive wherein the fixed part is further coated and reinforced by insulating adhesive. CONSTITUTION:Electrode layers 2 are provided on both sides of a semiconductor wafer 1 made of transition metal oxide as main constituent and protective layers 3 are further coated on the layers 2 and cutted grooves 4 for lead wire connection are provided. Conductive adhesive 6 is applied to the part of the grooves 4 or the exposed part of the layers 2. Then, metal lead wires 5 are applied to the adhesive 6 to stick and fix and the wires 5 are positioned at the center by inserting in insulating supporters such as porcelain tubes 8. Finally, insulating material 7 is filled up and the applied part by the above conductive adhesive is coated to burn. It is preferable that the conductive adhesive consists of noble metal powder and a glass constituent with 10% or less and that the metal lead wires are heat resistant Ni alloy ones which have a noble metal wire at the pointed part. |
