| 摘要 |
PURPOSE:To reduce thickness of a circuit substrate as a whole, by making it a layer structure in such a manner as to laminate glass-epoxy resin substrate on metallic sheet with adhesive. CONSTITUTION:A circuit substrate 20 is formed into a layer structure by laminating a glass-epoxy resin substrate 20a onto a metallic sheet 21 with a filmlike adhesive 22. This metallic substrate 21 is to serve the purpose of reinforcing the glass-epoxy resin substrate 20a, and print wiring 23 is formed on the top surface of this substrate 20a, and further, a recess 20b is formed in a prescribed position on this metallic substrate 21 for keeping LSI6 which is to drive a watch. The LSI6 is molded by a molding material 6a in a condition that it is electrically conducted to the printed wiring 23. In the circuit substrate 20, a metallic post 24 is securely attached to a prescribed position on a frame 1 in a condition that the LSI6 is molded, and then, it is pressed into a fit-in hole on the circuit substrate 20 of layer structure to be securely attached. |
