| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric device, which simplifies management of a conductive adhesive and improves bonding strength between the conductive adhesive and a piezoelectric element.SOLUTION: The method of manufacturing a piezoelectric device includes: a conductive adhesive application step of applying a conductive adhesive 140 to an electrode pad 111 provided on a package 110; a solvent application step of applying a solvent to the conductive adhesive 140; a piezoelectric element mounting step of placing a piezoelectric element 120 on the conductive adhesive 140 and curing the conductive adhesive 140, thereby mounting the piezoelectric element 120; and a lid bonding step of bonding a lid 130 to the package 110 in order to air-tightly seal the piezoelectric element 120.SELECTED DRAWING: Figure 2 |
