| 摘要 |
The present invention relates to a substrate cooling system capable of cooling one or more substrates. The system comprises: a chamber unit; a cooling cassette unit placed on the inside of the chamber unit, and capable of cooling multiple substrates; a cassette moving unit placed on a lower side of the chamber unit to move the cooling cassette unit upwards or downwards; and a coolant supplying unit connected to the cooling cassette through a cooling pipe, and supplying coolant to the cooling cassette unit through the cooling pipe to cool the substrate in the cooling cassette unit. The cooling cassette unit comprises: a cooling cassette case having a space for cooling the substrate; a cooling plate placed inside the cooling cassette case, and coming in contact with one surface of the substrate to cool the substrate; and a substrate holder placed on one or both sides of the cooling plate, and supporting the substrate to make one surface of the substrate received on a lower side of the cooling plate come in contact with the cooling plate. Therefore, since the cooling cassette unit cools multiple substrates by coming in contact with one surface of each substrate, the cooling time is shortened and the number of substrates cooled within unit time is increased. Moreover, since the entire substrate is uniformly cooled, damage due to non-uniform cooling of the substrate is suppressed. |
