PICK AND PLACEMENT DEVICE

摘要

The present invention relates to a pick and placement device, accurately and efficiently separating and picking up a cut semiconductor chip attached on a taped semiconductor chip frame to perform vision inspection to be transferred to a discharge tray to be discharged. The purpose of the present invention is to provide the pick and placement device, accurately and efficiently separating and picking the semiconductor chip to perform the vision inspection to be transferred to the discharge tray to be discharged.