发明名称 THERMOCONDUCTIVE COMPOSITION, THERMOCONDUCTIVE ADHESIVE SHEET, AND PREPARATION METHOD THEREOF
摘要 The present invention relates to a thermoconductive composition for protecting the device integrated inside an electronic device or the like from the heat, to a thermoconductive adhesive sheet, and to a manufacturing method thereof. The thermoconductive composition and the thermoconductive adhesive sheet have carbon-based powder with the high purity and a metal ingredient for improving the thermoconductivity as a filling material, thereby being environmentally friendly, easily controlling the thickness, and being flexible. The heat generated from a heat source can be effectively removed by applying a light-emitting source such as LED, OLED, and the like, or by being attached to an electronic device or a lighting device in which an IC chip is high-density integrated.
申请公布号 KR101642052(B1) 申请公布日期 2016.07.22
申请号 KR20150138792 申请日期 2015.10.01
申请人 INNOPOLE CO., LTD. 发明人 KIM, DONG HA
分类号 C08K3/04;C08K3/08;C08L101/00;C09J9/00;C09J11/04 主分类号 C08K3/04
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