| 摘要 |
PURPOSE:To improve the band properties of an ultrasonic delay line by making even the thickness of a solder layer by mixing grains of metal of constant grain size with solder which sticks a piezoelectric converting element to a glass medium. CONSTITUTION:With solder which sticks glass medium 1 to piezoelectric converting element 2, grains of metal, such as gold and copper, and glass of constant grain size are mixed. Using the solder like this restricts the thickness of a solder layer by the grain size of mixed grains. Therefore, an adhesive layer of even thickness with a little dispersion can be formed by using the solder with additional grains of metal, etc., of grain size selected according to the adhesive layer of needed thickness, so that a broad-band acoustic delay line can be obtained. |
