| 摘要 |
PURPOSE:To eliminate soldering of a semiconductor integrated circuit (IC) by engaging the semiconductor IC with the recess of an insulating plate, coating an insulating film having lead wires connected to the terminals of the 1C on the insulating plate, securing the plate through a cushion by a metal plate and clamping the plate to a printed board with screws. CONSTITUTION:A semiconductor IC 5 having terminals 6-11 is engaged within the recess 2 on the upper surface of an insulating plate 1 made of plastic or the like, and an insulating film 12 made of Teflon or the like is coated thereon. Coating-like lead wires 13-18 are formed on the film 12 and connected to the terminals, respectively of the IC 5. A metal plate 20 is then coated through a cushion 19 made of synthetic rubber or the like on the plate, the ends of the bent portions 21, 22 of the plate 20 are inserted into the recesses 3, 4 formed on the lower surface of the insulating plate 1, and the entirety is secured. The entire plate is placed on a printed board, and screws are inserted into the holes 23, 24 perforated at the respective components to secure them to the printed board. Thus, the IC can be connected to the printed board without using solder at all. |
