High pass filters and low pass filters using through glass via technology

摘要

A filter includes a glass substrate having through substrate vias. The filter also includes capacitors supported by the glass substrate. The capacitors may have a width and/or thickness less than a printing resolution. The filter also includes a 3D inductor within the substrate. The 3D inductor includes a first set of traces on a first surface of the glass substrate coupled to the through substrate vias. The 3D inductor also includes a second set of traces on a second surface of the glass substrate coupled to opposite ends of the through substrate vias. The second surface of the glass substrate is opposite the first surface of the glass substrate. The through substrate vias and traces operate as the 3D inductor. The first set of traces and the second set of traces may also have a width and/or thickness less than the printing resolution.

主权项

1. A filter fabricated using a semiconductor process, comprising:
a glass substrate having a plurality of through substrate vias; a plurality of capacitors supported by the glass substrate, a width of at least one of the plurality of capacitors being less than ten micrometers and a thickness of the at least one capacitor being less than one micrometer, the width and thickness of the at least one capacitor being less than a width and thickness of a capacitor fabricated using a printing process; and at least one 3D inductor within the glass substrate having an inductor spacing of less than a printing resolution spacing of ten micrometers, the at least one 3D inductor comprising:
a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias; anda second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces surrounding a solid glass core of the glass substrate and operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution in which at least one of the plurality of capacitors is coupled to a trace of the at least one 3D inductor.