发明名称 |
3-D package having plurality of substrates |
摘要 |
A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first plurality of connectors over and electrically coupled to the redistribution lines. A first die is over and bonded to the first plurality of connectors. The first die includes a second substrate, and through-vias in the second substrate. A second die is over and bonded to the plurality of connectors. The first die and the second die are electrically coupled to each other through the redistribution lines. A second plurality of connectors is over the first die and the second die. The second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate. |
申请公布号 |
US9425128(B2) |
申请公布日期 |
2016.08.23 |
申请号 |
US201414586524 |
申请日期 |
2014.12.30 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chang Chin-Chuan;Lin Jing-Cheng;Yu Chen-Hua |
分类号 |
H01L23/48;H01L23/522;H01L23/498;H01L21/48;H01L21/56;H01L21/78;H01L23/495;H01L23/538;H01L23/00;H01L25/065;H01L25/00;H01L23/367;H01L21/768;H01L23/14;H01L23/31 |
主分类号 |
H01L23/48 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A package comprising:
an interposer free from active devices therein, the interposer comprising:
a first substrate free from through-vias therein, wherein the first substrate comprises a plurality of trenches extending from a bottom surface of the first substrate into the first substrate;redistribution lines over the first substrate; anda first plurality of connectors over and electrically coupled to the redistribution lines; a first die over and bonded to the first plurality of connectors, wherein the first die comprises:
a second substrate; andthrough-vias in the second substrate; a second die over and bonded to the first plurality of connectors, wherein the first die and the second die are electrically coupled to each other through the redistribution lines; and a second plurality of connectors over the first die and the second die, wherein the second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate. |
地址 |
Hsin-Chu TW |