Semiconductor apparatus with transportable edge ring for substrate transport

摘要

An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.

主权项

1. An apparatus for processing semiconductor substrates, said apparatus comprising:
a rotatable disc capable of receiving a semiconductor substrate thereon and having a terraced outer edge having an upper edge portion with a smaller upper outer diameter than a lower outer diameter of a lower edge portion, wherein said substrate contacts said disc while said disc is rotating; a susceptor adapted to receive said rotatable disc thereon or therein; and an edge ring extending circumferentially around a periphery of said rotatable disc and configured to rest on a top surface of said lower edge portion, said edge ring including a horizontal surface capable of receiving a peripheral edge of said substrate thereon and a vertical portion disposed peripherally outside said horizontal surface.