PRINTED WIRING BOARDS AND MANUFACTURING METHOD THEREOF

摘要

A printed wiring board comprises: a first wiring substrate unit having a first insulation layer and a conductor wire having a first conductor wire located on the first insulation layer; and a bonding layer located on a first wiring substrate, configured to cover the first conductor wire, and buried in the conductor wire. The first insulation layer has two first cover layers, which are thermoplastic polyimide agents, and a first core layer of a polyimide agent interposed between the two first cover layers. The bonding layer is a thermoplastic polyimide agent.