APPARATUS AND METHOD FOR PROCESSING WAFER

摘要

Provided are an apparatus and a method for processing a wafer, which can improve reliability of a wafer treating process. According to an embodiment of the present invention, the wafer processing apparatus comprises: a chamber including a gate through which a wafer is transferred into and out of the chamber, and forming an enclosed process space; a susceptor assembly installed in the bottom of the chamber, and having a mounting unit having the wafer mounted on an upper surface; and a first sensor unit including at least one sensor provided at a position facing an upper surface of the wafer loaded on the mounting unit. The wafer processing apparatus can detect whether the wafer is separated from the mounting unit or not, based on a distance value from the first sensor unit to the upper surface of the wafer.