SEMICONDUCTOR DEVICE, PLATING TREATMENT METHOD, PLATING TREATMENT SYSTEM AND STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To improve adhesiveness between a catalyst adsorption layer on a substrate and a barrier metal plating layer.SOLUTION: A catalyst solution is supplied to a substrate 2 to form a catalyst adsorption layer 22 containing a catalyst metal on the substrate 2, and a plating treatment is applied onto the catalyst adsorption layer 22 by using the catalyst metal as a catalyst, to thereby form a joint metal layer 22A containing a joint metal which is different from the catalyst metal. A plating treatment is applied onto the joint metal layer 22A by using the joint metal as a catalyst, to thereby form a barrier metal plating layer 23.SELECTED DRAWING: Figure 3