| 摘要 |
<p>A method of manufacturing an acoustic surface wave device comprising: forming two pairs of transducers (2-1, 2-2 and 3-1, 3-2), a multistrip coupler (8) and lead patterns (10) for electrically shorting at least one pair of the transducers on a piezoelectric material (1); mounting the piezoelectric material (1) on a package base (11) having pins (12, 13); bonding the electrodes (9) of the opened transducers to the pins (12, 13) by wires (W1, W2, W3, W4); and testing the device. In this manufacturing method, testing is carried out without using probing technology.</p> |
