| 摘要 |
<p>A circuit assembly has a thin film component, supported on a major surface 11 of a substantially planar substrate 10, the substrate 10 having adjacent one edge a flange 20 extending normally to the component- bearing surface, the circuit assembly also having a plurality of leads 14, to extend externally of the circuit assembly, the leads traversing the flange, and being in sealing engagement with the flange, there being lead ends 14' adjacent to the component-bearing substrate surface, wires 16 are bonded between terminals 13 of the thin film component and the lead ends, and the wires, the thin film component, and the lead ends bonded to the wires, are encapsulated in a suitable plastics or silicone potting material 25. <IMAGE></p> |
