| 摘要 |
PURPOSE:To readily dispose external connection terminals in high density and improve the heat dissipating effect of an IC package by forming a number of solder dots functioning as the external connection terminals of an IC chip on the surface of a cap of a package body containing the IC chip. CONSTITUTION:An IC chip 3 is mounted in a recess 2 formed at the center on a laminated ceramic package body 1. The recess 2 is sealed through a sealing adhesive layer 4 with a cap 5. A plurality of solder dots 6 are formed on the peripheral end surface of the cap 5 of the body 1. The dots 6 are electrically introduced through a metallized layer 7 inserted into the body 1 into the recess 2 and connected through bonding wires 8 to the terminal portions corresponding to the chips 3. A number of rugged radiators 9 are mounted on the body 1. |
