| 摘要 |
PURPOSE:To uniformalize the thickness of a brazing material and to prevent damage to chips caused by the stress-strain of the semiconductor device with brazed semiconductor chips on the copper stem for heat radiation, by scattering small projections on the surface of the stem and by brazing the semiconductor chips with these small projections. CONSTITUTION:A number of small projections 14 are provided on the surface of a copper stem 10. When a brazing is performed, a prescribed quantity of solder is placed on the small projection group 14, on which chips 13 are placed and they are passed through a solder melting furnace. While the solder 15 is being melted, the solder is solidified by cooling, by means of oscillating or rotating the collet and pushing down the chips at the same time. As the brazing of the chips are performed on the small projections, the thickness of the brazing material is easily controlled and the damage to the chips due to the strain of the stem can be eliminated. |
