| 摘要 |
<p>A metallic or semiconductor material is deposited on a substrate of low roughness. The use of alumina as an intermediate material improves the bonding properties and localises the microwave skin effects in the metallic deposits. A hermetically sealed enclosure (11) has a vacuum pump (12) attached and contains a support (13) on which a glass substrate (14) is mounted. The face is masked (15) to represent the negative of a circuit as required. Two crucibles (16, 17) are connected to ac sources (20, 23) via switches (19, 22) to allow aluminium (Al) and a deposition material (M) to be evaporated and deposited on the substrate. The aluminium is evaporated before the vacuum is completely established and the deposition material is applied on it when the vacuum conditions are created. The material (M) may be gold, copper or cadmium sulphate.</p> |
