| 摘要 |
PURPOSE:To eliminate the need for anticorrosive plating for a lead frame and to lower the cost of the product by silver-plating the wire-bonding area of the frame made of stainless steel and bonding a chip with silver paste. CONSTITUTION:The chip-bonding area of a lead frame 1 made of stainless steel, a LSI chip 2 is bonded with silver paste. The wire-bonding area of the frame is silver-plated, and to the plated area, one end of a bonding wire 3 is bonded. The other end of the wire 3 is connected to the bonding pad of the chip 2. The chip 2 and its neighboring lead area are sealded by molding with a resin package 4. Thus, making up the frame 1 of stainless steel eliminates the need for anticorrosive plating, and applying silver paste and silver-plating permits the cost of the product to be lowered. |
