Component mounting apparatus.

摘要

An improved component engaging apparatus (T) for mounting electrical and electronic components or the like onto a circuit board or substrate (23) which includes a bonding agent applying unit (90) for applying the bonding agent onto the substrate (2,3) a chip component mounting section (120) for mounting electronic parts onto the bonding agent on the substrate (2,3) a chip component feeding section (160) for sequentially feeding the chip components, a driving section (30) forthe chip component feeding section (160), and a substrate support section (5) which is arranged to alter its position with respect to the chip component mounting section (120) and bonding agent applying section (90).