| 摘要 |
PURPOSE:To prevent faulty bonding of a pellet due to the warp of the bonding side of a ceramic substrate by almost uniformly bonding only the periphery of the bonding side of the semiconductor pellet to the ceramic substrate through a bonding layer. CONSTITUTION:On the concave area 11a of a laminated ceramic substrate 11, a semiconductor pellet 12 is mounted and bonded through a bonding layer 13. The pellet has a concave area 121a in the center of a bonding side 121. The concave area 121a is desired to be so deep that the projecting part of the base of the concave area 11a of the substrate 11 slightly touches the bottom of the concave area 121a of the pellet 12 when the pellet 12 is mounted on the concave area 11a. Thus, at least the periphery of the bonding side of the pellet 12 is surely bonded to the substrate 11, and the pellet 12 is prevented from cracking due to faulty bonding. |
